COPPER-POLYMER RESIN CONJUGATE AND METHOD FOR PREPARING SAME

WIPO Patent Application WO/2013/141607

A1

The present invention discloses a copper-polymer resin conjugate comprising a polymer resin, which comprises: i) copper; and ii) the polymer resin which is coupled after at least one surface treatment compound, which is selected from a group consisting of a diazole derivative, a diamine derivative, a thiol derivative, a pyrimidine derivative containing an S element, and a silane coupling agent, is treated on the copper, wherein a result of secondary ion mass spectrometry (SIMS) analysis of the copper-polymer resin conjugate yields an intensity ratio of each of C/Cu, N/Cu, O/Cu, Na/Cu, Si/Cu, P/Cu, and S/Cu that is between 3.8 × 10-4 and 4.9 × 10-1 at a depth of 0.5 to 2.0μm. The conjugate according to the present invention has the advantages of improving adhesive force between a metal and a resin and maintaining tensile strength and air tightness even after a heat shock test. Also the present invention can provide a copper-polymer resin conjugate having superior coupling force between the metal and the resin by using a variety of methods for increasing the coupling force with the resin, such as pretreatment, appropriate surface roughness, heat treatment, and surface coating, and by using a compound containing S, N, and Si.

JEONG EUH-DUCK (KR)
JANG EUN-KYUNG (KR)
HONG TAE-EUN (KR)
BAEK SEONG-LIM (KR)
KIM JONG-PIL (KR)
BAE JONG-SEONG (KR)
JIN JONG-SUNG (KR)
JUNG HONG-DAE (KR)
LEE SU-JONG (KR)

PCT/KR2013/002309

September 26, 2013

March 20, 2013

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KOREA BASIC SCIENCE INST (KR)
TAESUNG POLITECH CO LTD (KR)

C08L101/00; C08K3/08; C08K9/04; C23C22/00

JP4883425B2	2012-02-22
JPH0971753A	1997-03-18
JP4600701B2	2010-12-15
KR20100082854A	2010-07-20
JP2001200374A	2001-07-24

KIM, SUNG-HYUN (KR)
김성현 (KR)

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