Title:
COPPER POWDER FOR CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2012/043267
Kind Code:
A1
Abstract:
Provided is a copper powder for a conductive paste that has spherical copper microparticles that are singly dispersed microparticles, have a sharp grain size distribution, and do not include coarse grains. The copper powder avoids bad effects on electrical characteristics and can be formed into a thin film for electrodes. Also provided is a method that can stably manufacture that copper powder for a conductive paste. A complexing agent is added to form a complex of copper while air is blown into an aqueous solution containing copper; thereafter, the blowing in of air is stopped, a reducing agent added, and the copper particles precipitated by reduction.
Inventors:
KANESHIRO YUKI (JP)
SUENAGA SHINICHI (JP)
FUJITA HIDEFUMI (JP)
KISHIDA MINORU (JP)
SUENAGA SHINICHI (JP)
FUJITA HIDEFUMI (JP)
KISHIDA MINORU (JP)
Application Number:
PCT/JP2011/071175
Publication Date:
April 05, 2012
Filing Date:
September 12, 2011
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
KANESHIRO YUKI (JP)
SUENAGA SHINICHI (JP)
FUJITA HIDEFUMI (JP)
KISHIDA MINORU (JP)
KANESHIRO YUKI (JP)
SUENAGA SHINICHI (JP)
FUJITA HIDEFUMI (JP)
KISHIDA MINORU (JP)
International Classes:
B22F9/24; B22F1/052; B22F9/20; H01B1/22; H01B5/00; H01B13/00
Domestic Patent References:
WO2009001710A1 | 2008-12-31 |
Foreign References:
JP2010144197A | 2010-07-01 | |||
JP2008519156A | 2008-06-05 | |||
JP2010133015A | 2010-06-17 | |||
JP2005536634A | 2005-12-02 | |||
JP2002363618A | 2002-12-18 | |||
JP2005023395A | 2005-01-27 | |||
JPS63186803A | 1988-08-02 | |||
JPS63186805A | 1988-08-02 | |||
JPS63186811A | 1988-08-02 | |||
JPH01225705A | 1989-09-08 | |||
JPS63274706A | 1988-11-11 | |||
JP2003342621A | 2003-12-03 | |||
JP2004256857A | 2004-09-16 |
Other References:
See also references of EP 2614904A4
Attorney, Agent or Firm:
OKAWA, KOICHI (JP)
Koichi Okawa (JP)
Koichi Okawa (JP)
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Claims:
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