COPPER POWDER FOR CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING SAME

Title:

COPPER POWDER FOR CONDUCTIVE PASTE AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2012/043267

Kind Code:

A1

Abstract:

Provided is a copper powder for a conductive paste that has spherical copper microparticles that are singly dispersed microparticles, have a sharp grain size distribution, and do not include coarse grains. The copper powder avoids bad effects on electrical characteristics and can be formed into a thin film for electrodes. Also provided is a method that can stably manufacture that copper powder for a conductive paste. A complexing agent is added to form a complex of copper while air is blown into an aqueous solution containing copper; thereafter, the blowing in of air is stopped, a reducing agent added, and the copper particles precipitated by reduction.

Inventors:

KANESHIRO YUKI (JP)
SUENAGA SHINICHI (JP)
FUJITA HIDEFUMI (JP)
KISHIDA MINORU (JP)

Application Number:

PCT/JP2011/071175

Publication Date:

April 05, 2012

Filing Date:

September 12, 2011

Export Citation:

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Assignee:

DOWA ELECTRONICS MATERIALS CO (JP)
KANESHIRO YUKI (JP)
SUENAGA SHINICHI (JP)
FUJITA HIDEFUMI (JP)
KISHIDA MINORU (JP)

International Classes:

B22F9/24; B22F1/052; B22F9/20; H01B1/22; H01B5/00; H01B13/00

Domestic Patent References:

WO2009001710A1

2008-12-31

Foreign References:

JP2010144197A	2010-07-01
JP2008519156A	2008-06-05
JP2010133015A	2010-06-17
JP2005536634A	2005-12-02
JP2002363618A	2002-12-18
JP2005023395A	2005-01-27
JPS63186803A	1988-08-02
JPS63186805A	1988-08-02
JPS63186811A	1988-08-02
JPH01225705A	1989-09-08
JPS63274706A	1988-11-11
JP2003342621A	2003-12-03
JP2004256857A	2004-09-16

Other References: