Title:
COPPER POWDER FOR CONDUCTIVE PASTE, AND CONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2010/004852
Kind Code:
A1
Abstract:
A copper powder for a conductive paste contains 0.1 atm%-10 atm% of Si (silicon) and 0.1 atm%-10 atm% of In in the particle. It is preferable that the copper powder for a conductive paste contains 0.1 atm%-10 atm% of Ag (silver) in the particle. It is also preferable that the copper powder for a conductive paste contains 0.01 atm%-0.5 atm% of P (phosphorus). The ratio of Si/In (atm ratio) is preferably 0.5-5. The copper powder for a conductive paste is preferably manufactured by an atomization method.
Inventors:
OTA KOYU (JP)
KURIMOTO TORU (JP)
UWAZUMI YOSHIAKI (JP)
MIYAKE KOICHI (JP)
YOSHIMARU KATSUHIKO (JP)
KURIMOTO TORU (JP)
UWAZUMI YOSHIAKI (JP)
MIYAKE KOICHI (JP)
YOSHIMARU KATSUHIKO (JP)
Application Number:
PCT/JP2009/061241
Publication Date:
January 14, 2010
Filing Date:
June 19, 2009
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
OTA KOYU (JP)
KURIMOTO TORU (JP)
UWAZUMI YOSHIAKI (JP)
MIYAKE KOICHI (JP)
YOSHIMARU KATSUHIKO (JP)
OTA KOYU (JP)
KURIMOTO TORU (JP)
UWAZUMI YOSHIAKI (JP)
MIYAKE KOICHI (JP)
YOSHIMARU KATSUHIKO (JP)
International Classes:
B22F1/00; B22F9/08; C22C9/00; C22C9/10; H01B1/22; H01B5/00; H01G4/12; H01G4/30
Foreign References:
| JP2000273506A | 2000-10-03 | |||
| JPS58104970A | 1983-06-22 | |||
| JP2004169081A | 2004-06-17 | |||
| JPH0920942A | 1997-01-21 | |||
| JP2003064433A | 2003-03-05 | |||
| JPH0773730A | 1995-03-17 |
Attorney, Agent or Firm:
HATORI OSAMU (JP)
Osamu Hatori (JP)
Osamu Hatori (JP)
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