Title:
COPPER POWDER FOR CONDUCTIVE PASTE, AND CONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2011/145378
Kind Code:
A1
Abstract:
Provided is a novel copper powder for a conductive paste wherein it is possible to fully control the sintering temperature property between the temperature range of 500 to 900°C while maintaining oxidation resistance. Specifically, provided is a copper powder for a conductive paste, which contains Si (silicon) and P (phosphorus), wherein the Si concentration is 0.01 atm% or more and less than 1.2 atm%, and the Si equivalent (Si concentration × D50) calculated by multiplying the Si concentration with D50 (µm) is 3.50 or less.
Inventors:
OTA KOYU (JP)
SASAKI TAKUYA (JP)
YOSHIMARU KATSUHIKO (JP)
SASAKI TAKUYA (JP)
YOSHIMARU KATSUHIKO (JP)
Application Number:
PCT/JP2011/054598
Publication Date:
November 24, 2011
Filing Date:
March 01, 2011
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
OTA KOYU (JP)
SASAKI TAKUYA (JP)
YOSHIMARU KATSUHIKO (JP)
OTA KOYU (JP)
SASAKI TAKUYA (JP)
YOSHIMARU KATSUHIKO (JP)
International Classes:
B22F1/00; C22C9/00; C22C9/10; H01B1/24; H01B5/00; B22F1/107
Domestic Patent References:
| WO2010004852A1 | 2010-01-14 |
Foreign References:
| JP2009079269A | 2009-04-16 | |||
| JPH10308120A | 1998-11-17 | |||
| JP2004263205A | 2004-09-24 |
Attorney, Agent or Firm:
TAKEUCHI, ICHIZAWA & ASSOCIATES (JP)
Patent business corporation Takeuchi and an Ichizawa international patent firm (JP)
Patent business corporation Takeuchi and an Ichizawa international patent firm (JP)
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