Title:
COPPER POWDER FOR LAMINATE SHAPING, LAMINATE SHAPED BODY, METHOD FOR MANUFACTURING LAMINATE SHAPED BODY, AND LAMINATE SHAPING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/250811
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a copper powder which is for laminate shaping and from which a laminate shaped article of copper having a high electrical conductivity, for example, of at least 80% IACS can be shaped. The present invention is a copper powder which is for laminate shaping and in which 0.01-0.20 wt% of a nano-oxide is mixed with a copper powder. Moreover, provided is a laminate shaped body using the copper powder for laminate shaping according to the present invention. Furthermore, provided are: a method for manufacturing the laminate shaped body using the copper powder for laminate shaping according to the present invention; and a laminate shaping apparatus.
Inventors:
SUGITANI YUJI (JP)
KYOGOKU HIDEKI (JP)
KYOGOKU HIDEKI (JP)
Application Number:
PCT/JP2020/022203
Publication Date:
December 17, 2020
Filing Date:
June 04, 2020
Export Citation:
Assignee:
FUKUDA METAL FOIL & POWDER CO LTD (JP)
TECH RES ASSOCIATION FUTURE ADDITIVE MANUFACTURING (JP)
TECH RES ASSOCIATION FUTURE ADDITIVE MANUFACTURING (JP)
International Classes:
B22F1/00; B22F3/105; B22F3/16; B33Y10/00; B33Y30/00; B33Y70/00; B33Y80/00; B82Y30/00; B82Y40/00; C22C1/05
Domestic Patent References:
| WO2019064745A1 | 2019-04-04 | |||
| WO2019017467A1 | 2019-01-24 |
Foreign References:
| JP2004332016A | 2004-11-25 | |||
| JP2019110429A | 2019-07-04 | |||
| JP2016041850A | 2016-03-31 | |||
| JPS633016B2 | 1988-01-21 |
Other References:
TADASHI MIZOGUCHI: "Fundamentals of Materials Science, Solid State Physics", April 1989, SHOKABO, pages: 126 - 128
See also references of EP 3950176A4
See also references of EP 3950176A4
Attorney, Agent or Firm:
KATO Takashi (JP)
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