Title:
COPPER POWDER FOR LAYER MOLDING, AND LAYER MOLDED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/235213
Kind Code:
A1
Abstract:
The present invention can obtain a layer molded product having high density and high electrical conductivity through development of a copper powder for layer molding to which phosphorus (P) is added so as to suitably reduce the electrical conductivity of copper and thereby obtain a high-density layer molded product using a layer molding method in which a fiber laser is used as a heat source. The present invention is a copper powder for layer molding, in which phosphorus element is added to pure copper. The copper powder for layer molding preferably contains 0.01 wt% or more of phosphorus element. In addition, the copper powder for layer molding preferably contains 0.04 wt% or more of phosphorus element. In addition, the copper powder for layer molding preferably contains 0.30 wt% or less of phosphorus element. In addition, the copper powder for layer molding preferably contains 0.24 wt% or less of phosphorus element. In addition, it is preferable for elements other than phosphorus element not to be added to the copper powder for layer molding.
Inventors:
SUGITANI YUJI (JP)
NISHIZAWA YOSHITO (JP)
MARUYAMA TAKESHI (JP)
OKUBO HIROAKI (JP)
NISHIZAWA YOSHITO (JP)
MARUYAMA TAKESHI (JP)
OKUBO HIROAKI (JP)
Application Number:
PCT/JP2017/022931
Publication Date:
December 27, 2018
Filing Date:
June 21, 2017
Export Citation:
Assignee:
FUKUDA METAL FOIL & POWDER CO LTD (JP)
TECH RES ASSOCIATION FUTURE ADDITIVE MANUFACTURING (JP)
TECH RES ASSOCIATION FUTURE ADDITIVE MANUFACTURING (JP)
International Classes:
B22F3/105; B22F3/16; B22F1/00; B22F1/052
Foreign References:
| JP2000336403A | 2000-12-05 | |||
| JP2016211062A | 2016-12-15 | |||
| JP2016053198A | 2016-04-14 |
Other References:
See also references of EP 3643428A4
Attorney, Agent or Firm:
KATO Takashi et al. (JP)
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