Title:
COPPER POWDER AND COPPER PASTE, CONDUCTIVE COATING MATERIAL, AND CONDUCTIVE SHEET USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/151858
Kind Code:
A1
Abstract:
Provided is a copper powder that has an increased number of points of contact between copper powder particles, that ensures excellent conductivity, and that can be suitably used in a conductive paste, an electromagnetic wave shield, or the like. The copper powder is configured from flat plate-shaped copper particles 1 that form a dendritic shape having a linearly grown main trunk and a plurality of branches branching from the main trunk. The main trunk and the branches have an average cross-sectional thickness of more than 1.0 µm but no more than 5.0 µm. The copper powder has a flat plate shape that is configured from a layered structure of one layer or a plurality of stacked layers. The average particle size (D50) is 1.0-100 µm.
Inventors:
OKADA HIROSHI (JP)
YAMASHITA YU (JP)
YAMASHITA YU (JP)
Application Number:
PCT/JP2015/059481
Publication Date:
September 29, 2016
Filing Date:
March 26, 2015
Export Citation:
Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
B22F1/00; B22F1/052; B22F1/10; B22F1/14; C09C1/62; C09D5/24; C09D201/00; C25C5/02; H01B1/00; H01B1/22; H01B5/00
Foreign References:
| JP2013053347A | 2013-03-21 | |||
| JP2013100592A | 2013-05-23 | |||
| JP5503813B1 | 2014-05-28 | |||
| JP2011214032A | 2011-10-27 |
Other References:
See also references of EP 3275570A4
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (JP)
Right wood Masayuki (JP)
Right wood Masayuki (JP)
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