COPPER POWDER, COPPER PASTE, METHOD FOR MANUFACTURING CONDUCTIVE COATING FILM, AND CONDUCTIVE COATING FILM

Title:

COPPER POWDER, COPPER PASTE, METHOD FOR MANUFACTURING CONDUCTIVE COATING FILM, AND CONDUCTIVE COATING FILM

Document Type and Number:

WIPO Patent Application WO/2012/157704

Kind Code:

A1

Abstract:

[Problem] To provide copper powder and copper paste for forming a copper powder-containing coating film that can be treated through electroless metal plating without using an expensive catalyst such as palladium, and a method for manufacturing a conductive coating film by forming a copper powder-containing coating film using the copper paste and treating the coating film through an electroless metal plating process or a heating process using superheated steam. [Solution] Provided is a method for manufacturing a conductive coating film using copper powder and copper paste including the copper powder. The copper powder has an average grain diameter of 0.05 to 2 μm measured by an SEM and satisfies Formula 1 where SSA denotes a BET specific surface area (m2/g) and C denotes a carbon concentration (weight %). In the method, a copper powder-containing coating film is formed on an insulating substrate by using the copper powder and the copper paste and is dried, and an electroless metal plating process or a heating process using superheated steam is performed on the coating film. C/SSA≤7x10-2……[1]

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Inventors:

ITO CHIHO (JP)
TATSUKA TAKESHI (JP)
KAKIHARA YASUO (JP)

Application Number:

PCT/JP2012/062658

Publication Date:

November 22, 2012

Filing Date:

May 17, 2012

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Assignee:

TODA KOGYO CORP (JP)
ITO CHIHO (JP)
TATSUKA TAKESHI (JP)
KAKIHARA YASUO (JP)

International Classes:

B22F1/00; B22F1/05; B22F1/107; H01B5/14; H01B13/00; H05K3/12

Foreign References:

JP2009074152A	2009-04-09
JP2011094236A	2011-05-12
JP2007157563A	2007-06-21

Attorney, Agent or Firm:

OKADA, KAZUHIKO (JP)
Kazuhiko Okada (JP)

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