COPPER POWDER, COPPER PASTE USING SAME, CONDUCTIVE COATING MATERIAL, CONDUCTIVE SHEET, AND METHOD FOR PRODUCING COPPER POWDER

WIPO Patent Application WO/2016/185629

A1

Provided is a copper powder which is capable of being suitably employed for use as a conductive paste, an electromagnetic-wave shield, and the like, while ensuring excellent conductivity by increasing contact points between the copper powder. A copper powder 1 according to the present invention forms a dendritic shape having a trunk 2 which grows linearly, and a plurality of branches 3 which branch off from the trunk 2. Plate-shaped copper particles having an average cross-sectional thickness of 0.02-5.0 µm agglomerate to form the trunk 2 and the branches 3. The average particle size (D50) of the copper powder 1 is 1.0-100 µm. The maximum height of the plate-shaped surfaces of the copper particles in the vertical direction is not more than 1/10 of the maximum length of the plate-shaped surfaces in the horizontal direction.

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OKADA HIROSHI (JP)
YAMASHITA YU (JP)

PCT/JP2015/080263

November 24, 2016

October 27, 2015

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SUMITOMO METAL MINING CO (JP)

B22F1/00; B22F1/06; B22F9/24; C25C5/02; H01B1/00; H01B1/22; H01B5/00

WO2015115139A1

2015-08-06

JP2013019034A	2013-01-31
JP2013053347A	2013-03-21
JP2013168375A	2013-08-29
JP2011214032A	2011-10-27
JP5790900B1	2015-10-07

See also references of EP 3296041A4

SHOBAYASHI, Masayuki et al. (JP)
正林 真之 (JP)

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