Title:
COPPER POWDER
Document Type and Number:
WIPO Patent Application WO/2015/122251
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a novel copper powder for which powder compacting resistance is low and which is capable of maintaining excellent electrical conductivity even if the power is a microparticulate copper powder. The present invention is a copper powder characterized in that the volume cumulative particle diameter D50 measured using a laser diffraction scattering particle size distribution-measuring device is 0.20 µm - 0.70 µm and the ratio of crystallite diameter with respect to said D50 (crystallite diameter/D50) is 0.15 - 0.60 (µm/ µm).
Inventors:
OTA KOYU (JP)
SYOUJIGUCHI TAKASHI (JP)
SYOUJIGUCHI TAKASHI (JP)
Application Number:
PCT/JP2015/051512
Publication Date:
August 20, 2015
Filing Date:
January 21, 2015
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
B22F1/00; B22F1/052; B22F1/065; H01B5/00; B22F1/107
Foreign References:
| JP2010018880A | 2010-01-28 | |||
| JP2005154861A | 2005-06-16 | |||
| JP2005314755A | 2005-11-10 | |||
| JP2012126942A | 2012-07-05 | |||
| JP2014034697A | 2014-02-24 | |||
| JP2014001443A | 2014-01-09 | |||
| JP2006169559A | 2006-06-29 |
Attorney, Agent or Firm:
TAKEUCHI, ICHIZAWA & ASSOCIATES (JP)
Patent business corporation Takeuchi and an Ichizawa international patent firm (JP)
Patent business corporation Takeuchi and an Ichizawa international patent firm (JP)
Download PDF: