Title:
COPPER REMOVING DEVICE FOR CONDUCTIVE BAND
Document Type and Number:
WIPO Patent Application WO/2023/179733
Kind Code:
A1
Abstract:
A copper removing device for a conductive band. The copper removing device comprises: a copper deplating tank and a conductive band transmission mechanism, wherein the copper deplating tank is used for accommodating a copper deplating solution, and is provided with a first strip-shaped hole and a second strip-shaped hole which allow a conductive band to transversely pass therethrough; the conductive band transmission mechanism is used for transmitting the conductive band, and makes the conductive band transversely pass through the copper deplating tank via the first strip-shaped hole and the second strip-shaped hole and be immersed in the copper deplating solution, and the conductive band has electropositivity; and a cathode plate connected to a negative electrode of a power supply is arranged in the copper deplating tank and is located on the upper side and/or the lower side of the conductive band. When a conductive band enters the copper deplating tank, under the action of a cathode plate immersed in a copper deplating solution, a copper layer on the surface of the conductive band is ionized to then generate copper ions that can freely move in the copper deplating solution, such that the copper layer on the surface of the conductive band is removed.
Inventors:
ZANG SHIWEI (CN)
Application Number:
PCT/CN2023/083482
Publication Date:
September 28, 2023
Filing Date:
March 23, 2023
Export Citation:
Assignee:
CHONGQING JIMAT NEW MATERIAL TECH CO LTD (CN)
International Classes:
C25F5/00; C25D17/00; C25F7/00
Foreign References:
| CN215560750U | 2022-01-18 | |||
| CN204959074U | 2016-01-13 | |||
| CN210481570U | 2020-05-08 | |||
| CN113897663A | 2022-01-07 | |||
| CN113249770A | 2021-08-13 | |||
| CN213086166U | 2021-04-30 | |||
| CN104342748A | 2015-02-11 | |||
| CN105297128A | 2016-02-03 | |||
| US6352636B1 | 2002-03-05 | |||
| JP2000064099A | 2000-02-29 | |||
| CN114703538A | 2022-07-05 | |||
| CN113249770A | 2021-08-13 |
Other References:
RAO RONG, SONG MING; CHENG HAO; QIU ZUMIN: "Research on the Copper Recycling Process for the Stripping Solution of Waste ABS Plastic Electro-plating", JOURNAL OF NANCHANG UNIVERSITY (ENGINEERING & TECHNOLOGY), vol. 37, no. 1, 28 March 2015 (2015-03-28), pages 7 - 10, XP093094601, ISSN: 1006-0456, DOI: 10.13764/j.cnki.ncdg.2015.01.002
Attorney, Agent or Firm:
BEIJING EASY JOY SOON IP AGENT LTD (CN)
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