Title:
COPPER SHEET MATERIAL AND METHOD FOR PRODUCING SAME, AND INSULATION SUBSTRATE WITH COPPER SHEET MATERIAL
Document Type and Number:
WIPO Patent Application WO/2021/145148
Kind Code:
A1
Abstract:
A copper sheet material according to an embodiment has a composition comprising 99.96% by mass or more of Cu and unavoidable impurities, and has such a property that the area percentage of crystal grains each having a GAM value, which is obtained from a crystal orientation analysis data in accordance with SEM-EBSD method, of less than 0.5° is 5% or less and the area percentage of crystal grains each having a GAM value of 0.5° or more and less than 1.0° is 50% or more.
Inventors:
KAWATA SHINGO (JP)
DANJO SHOICHI (JP)
HIGUCHI MASARU (JP)
TAKAZAWA TSUKASA (JP)
DANJO SHOICHI (JP)
HIGUCHI MASARU (JP)
TAKAZAWA TSUKASA (JP)
Application Number:
PCT/JP2020/047590
Publication Date:
July 22, 2021
Filing Date:
December 21, 2020
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C22C9/00; C22F1/08; C22F1/00
Domestic Patent References:
| WO2019187767A1 | 2019-10-03 | |||
| WO2018181593A1 | 2018-10-04 | |||
| WO2020162445A1 | 2020-08-13 |
Foreign References:
| JP2018204108A | 2018-12-27 |
Attorney, Agent or Firm:
SAITO Takuya et al. (JP)
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