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Title:
COPPER SLAG DEPLETION DEVICE AND METHOD
Document Type and Number:
WIPO Patent Application WO/2019/242607
Kind Code:
A1
Abstract:
A copper slag depletion device and method. The device comprises a copper slag depletion treatment furnace (10) and a wire feeding device (20), wherein the copper slag depletion treatment furnace (10) uses electrothermal or plasma heat as a heat source; the copper slag depletion treatment furnace (10) is provided with a copper slag inlet, a wire feeding hole and a matte opening; the copper slag inlet is used to introduce copper slag (a), and the matte opening is used to discharge copper matte (c) obtained by a reduction and depletion treatment; the wire feeding device (20) is used for feeding a carbon powder wire (b) into the copper slag depletion furnace (10) by means of the wire feeding hole so as to perform a reduction and depletion treatment on the copper slag (a). The copper slag depletion device is capable of improving the reduction and depletion efficiency of copper slag, and has a short process, low costs, may simultaneously recover heavy metals such as lead and zinc in the slag, and other effects.

Inventors:
GUO YAGUANG (CN)
WU JINCAI (CN)
LIANG SHUAIBIAO (CN)
PEI ZHONGYE (CN)
CHEN XUEGANG (CN)
Application Number:
PCT/CN2019/091716
Publication Date:
December 26, 2019
Filing Date:
June 18, 2019
Export Citation:
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Assignee:
CHINA ENFI ENG CORP (CN)
International Classes:
C22B7/04; C22B13/02; C22B15/00; C22B19/30
Foreign References:
CN108728660A2018-11-02
CN107036443A2017-08-11
CN101914655A2010-12-15
US4168156A1979-09-18
CN105063371A2015-11-18
Attorney, Agent or Firm:
KANGXIN PARTNERS, P.C. (CN)
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