Title:
COPPER STRIP FOR EDGEWISE BENDING, AND ELECTRONIC/ELECTRICAL DEVICE COMPONENT AND BUSBAR
Document Type and Number:
WIPO Patent Application WO/2023/277197
Kind Code:
A1
Abstract:
A copper strip for edgewise bending, which involves performing edgewise bending at a ratio R/W for a bending radius R and width W of 5.0 or less, is characterized in that the thickness t is set within a range of 1 mm to 10 mm, inclusive, and the dimension a (μm) of burrs on an end face on one side extending in at least the longitudinal direction is a < (100 – D/2) with respect to the average grain size D (μm) at a plate thickness center portion.
Inventors:
FUKUOKA KOSEI (JP)
ITO YUKI (JP)
KAWASAKI KENICHIRO (JP)
MAKI KAZUNARI (JP)
ITO YUKI (JP)
KAWASAKI KENICHIRO (JP)
MAKI KAZUNARI (JP)
Application Number:
PCT/JP2022/026572
Publication Date:
January 05, 2023
Filing Date:
July 04, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; H01B1/02; H01B5/00; H01B5/02; H01B7/00; C22F1/00; C22F1/08
Domestic Patent References:
| WO2020122230A1 | 2020-06-18 | |||
| WO2020122112A1 | 2020-06-18 | |||
| WO2021060023A1 | 2021-04-01 | |||
| WO2022085718A1 | 2022-04-28 | |||
| WO2022085723A1 | 2022-04-28 |
Foreign References:
| JPS5466404A | 1979-05-29 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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