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Title:
COPPER STRIP FOR EDGEWISE BENDING, AND ELECTRONIC/ELECTRICAL DEVICE COMPONENT AND BUSBAR
Document Type and Number:
WIPO Patent Application WO/2023/277199
Kind Code:
A1
Abstract:
A copper strip for edgewise bending, which involves performing edgewise bending at a ratio R/W for a bending radius R and width W of 5.0 or less, for which the thickness t is set within a range of 1 mm to 10 mm, inclusive, and in a cross-section orthogonal to the longitudinal direction, defining, as a reference point, an intersection point of a straight line touching a surface parallel to the width direction and a straight line touching an end face perpendicular to the width direction, an area ratio B/(A+B) is within a range exceeding 10% but not more than 100%, said area ratio being calculated from an area (A) of a portion where copper is present and an area (B) of a portion where copper is not present in a square region in which the length of one side is 1/10 of the thickness t.

Inventors:
FUKUOKA KOSEI (JP)
ITO YUKI (JP)
KAWASAKI KENICHIRO (JP)
MAKI KAZUNARI (JP)
Application Number:
PCT/JP2022/026578
Publication Date:
January 05, 2023
Filing Date:
July 04, 2022
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; H01B1/02; H01B5/00; H01B5/02; H01B7/00; C22F1/00; C22F1/08
Domestic Patent References:
WO2020122230A12020-06-18
WO2020122112A12020-06-18
WO2021060023A12021-04-01
WO2022085718A12022-04-28
WO2022085723A12022-04-28
Foreign References:
JPS5466404A1979-05-29
JP2021110693A2021-08-02
JP2022060502A2022-04-14
JP2022106847A2022-07-20
JP2013004444A2013-01-07
JP2012195212A2012-10-11
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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