Title:
COPPER-TIN-OXYGEN BASED ALLOY PLATING
Document Type and Number:
WIPO Patent Application WO/2003/106739
Kind Code:
A1
Abstract:
A Cu-Sn-O based alloy plating comprising 0.3 at % to 50 at % of oxygen, 20 at % to 80 at % of copper, and 10 at% to 70 at % of tin. The Cu-Sn-O based alloy plating provides a copper-tin alloy excellent in the adhesion of a plating and in the stability of unbuttoning force, and further provides a Cu-Sn-O based alloy plating containing no regulated material and having a black or blackish color tone.
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Inventors:
URATA KAZUYA (JP)
KITAGAWA KAZUHIRO (JP)
OGAWA YUKIO (JP)
HASEGAWA KENJI (JP)
KITAGAWA KAZUHIRO (JP)
OGAWA YUKIO (JP)
HASEGAWA KENJI (JP)
Application Number:
PCT/JP2003/007484
Publication Date:
December 24, 2003
Filing Date:
June 12, 2003
Export Citation:
Assignee:
NIHON NEW CHROME CO LTD (JP)
YKK NEWMAX CO LTD (JP)
URATA KAZUYA (JP)
KITAGAWA KAZUHIRO (JP)
OGAWA YUKIO (JP)
HASEGAWA KENJI (JP)
YKK NEWMAX CO LTD (JP)
URATA KAZUYA (JP)
KITAGAWA KAZUHIRO (JP)
OGAWA YUKIO (JP)
HASEGAWA KENJI (JP)
International Classes:
A44B17/00; A44C27/00; C25D7/00; (IPC1-7): C25D7/00; A44B17/00
Foreign References:
| JPH10102278A | 1998-04-21 | |||
| JPS6411996A | 1989-01-17 | |||
| JP2002298963A | 2002-10-11 | |||
| EP1066895A2 | 2001-01-10 |
Other References:
See also references of EP 1553213A4
Attorney, Agent or Firm:
Ohie, Kunihisa (Horiguchi No.2 Bldg. 7F 2-6,
Nihonbashi-Ningyocho, 2-chom, Chuo-ku Tokyo, JP)
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