Title:
COPPER AND TITANIUM COMPOSITION FOR METAL LAYER ETCHING SOLUTION
Document Type and Number:
WIPO Patent Application WO/2011/136597
Kind Code:
A3
Abstract:
The present invention relates to a copper and titanium composition for a metal etching solution, comprising the following, based on the total weight of the composition: 5 to 20 wt % of persulfate; 0.01 to 2 wt % of a fluorine compound; 1-10 wt % of an additive containing one or more acids selected from inorganic acids, salts of inorganic acids, and a mixture thereof; 0.3 to 5 wt% of a cyclic amine compound; 0.01 to 8 wt % of an additive containing one or more compounds selected from a chlorine compound and cupric salts; and with the remainder being water.
Inventors:
LIM MIN-KI (KR)
KWON O-BYOUNG (KR)
LEE YU-JIN (KR)
YU IN-HO (KR)
LEE JOON-WOO (KR)
PARK YOUNG-CHUL (KR)
JANG SANG-HOON (KR)
KWON O-BYOUNG (KR)
LEE YU-JIN (KR)
YU IN-HO (KR)
LEE JOON-WOO (KR)
PARK YOUNG-CHUL (KR)
JANG SANG-HOON (KR)
Application Number:
PCT/KR2011/003178
Publication Date:
March 01, 2012
Filing Date:
April 28, 2011
Export Citation:
Assignee:
DONGWOO FINE CHEM CO LTD (KR)
LIM MIN-KI (KR)
KWON O-BYOUNG (KR)
LEE YU-JIN (KR)
YU IN-HO (KR)
LEE JOON-WOO (KR)
PARK YOUNG-CHUL (KR)
JANG SANG-HOON (KR)
LIM MIN-KI (KR)
KWON O-BYOUNG (KR)
LEE YU-JIN (KR)
YU IN-HO (KR)
LEE JOON-WOO (KR)
PARK YOUNG-CHUL (KR)
JANG SANG-HOON (KR)
International Classes:
C23F1/18
Foreign References:
| KR20100035250A | 2010-04-05 | |||
| KR20060099089A | 2006-09-19 | |||
| KR20020097348A | 2002-12-31 | |||
| US5298117A | 1994-03-29 |
Attorney, Agent or Firm:
HANYANG PATENT FIRM (412-1 Dogok-dong Gangnam-gu, Seoul 135-854, KR)
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Claims: