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Title:
CORE MATERIAL FOR MATTRESS AND BED MATTRESS
Document Type and Number:
WIPO Patent Application WO/2018/003456
Kind Code:
A1
Abstract:
This core material for a mattress is configured by stacking a plurality of flat cushion bodies in a thickness direction, wherein: the core material for a mattress comprises at least a first cushion body that is on the upper side during use and a second cushion body that is on the lower side during use; the first cushion body and the second cushion body are three-dimensionally connected filament bodies; the first cushion body and the second cushion body are each provided with an upper surface high-density layer having a high filament density that is formed on a surface layer region, a lower surface high-density layer having a high filament density that is formed on a lower side, and a low-density elastic layer having a lower filament density than the surface high-density layers and formed between the upper and lower surface high-density layers; and there is formed a high-density interlayer having a function for distributing, in an interface direction of two cushion bodies along a curve of the high-density interlayer, a compressive stress applied in the up/down direction, the interlayer being formed at a thickness direction middle position of the core material for a mattress in a state where the cushion bodies are being stacked vertically in the thickness direction.

Inventors:
ANDO, Tsuyoshi (8-288 Hiiragiyama-cho, Obu-sh, Aichi 53, 〒4740053, JP)
KOJIMA, Masakazu (8-288 Hiiragiyama-cho, Obu-sh, Aichi 53, 〒4740053, JP)
TAKAOKA, Motokuni (8-288 Hiiragiyama-cho, Obu-sh, Aichi 53, 〒4740053, JP)
Application Number:
JP2017/021400
Publication Date:
January 04, 2018
Filing Date:
June 08, 2017
Export Citation:
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Assignee:
AIRWEAVE INC. (8-288, Hiiragiyama-cho Obu-sh, Aichi 53, 〒4740053, JP)
International Classes:
A47C27/12; D04H3/037
Domestic Patent References:
WO2012157289A12012-11-22
Foreign References:
JP2016028900A2016-03-03
JP2014064768A2014-04-17
JP2010279687A2010-12-16
Attorney, Agent or Firm:
SAIKYO, Keiichiro (Saikyo Patent Office, Nomura Fudosan Osaka Building 9th Floor 8-15, Azuchimachi 1-chome, Chuo-ku, Osaka-sh, Osaka 52, 〒5410052, JP)
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