CORE MATERIAL FOR A VACUUM INSULATION PANEL FORMED OF A PHENOLIC RESIN-CURED FOAM AND VACUUM INSULATION PANEL USING SAME, AND METHOD FOR MANUFACTURING SAME

Title:

CORE MATERIAL FOR A VACUUM INSULATION PANEL FORMED OF A PHENOLIC RESIN-CURED FOAM AND VACUUM INSULATION PANEL USING SAME, AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2012/086954

Kind Code:

A3

Abstract:

The present invention relates to a core material for a vacuum insulation panel formed of a phenolic resin-cured foam and to a vacuum insulation panel using same, and to a method for manufacturing same. Particularly, the core material is formed of a phenolic resin-cured foam having a closed cell content of about 20% or less. Also, a cell thereof has a mean particle size of about 50 μm to about 500 μm, and a fine hole having a size of about 0.5 μm to about 30 μm is defined in the surface of the cell. Thus, the phenolic resin-cured foam may have a porosity of about 50% or more to provide superior insulation performance, ensure structural strength, and reduce manufacturing costs.

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Inventors:

KIM JUNG-KEUN (KR)
LEE EUNG-KEE (KR)
LEE MIN-HEE (KR)
KIM MYEONG-HEE (KR)

Application Number:

PCT/KR2011/009481

Publication Date:

October 04, 2012

Filing Date:

December 08, 2011

Export Citation:

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Assignee:

LG HAUSYS LTD (KR)
KIM JUNG-KEUN (KR)
LEE EUNG-KEE (KR)
LEE MIN-HEE (KR)
KIM MYEONG-HEE (KR)

International Classes:

C08J9/00; B32B5/18; C08L61/04; E04B1/78

Foreign References:

JP2001114922A	2001-04-24
JPH11277704A	1999-10-12
JP2010131848A	2010-06-17
JPH11343681A	1999-12-14
JP2000054522A	2000-02-22
JP2006057398A	2006-03-02
JP2006300123A	2006-11-02

Other References: