Title:
CORE SUBSTRATE, MULTILAYER WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR MODULE, COPPER-CLAD SUBSTRATE, AND METHOD FOR PRODUCING CORE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/105618
Kind Code:
A1
Abstract:
Provided is a technique which makes cracking of a glass core substrate less likely to occur. A core substrate 1 according to the present invention is provided with a glass plate 10 and a first conductor pattern 20 that is provided on one main surface of the glass plate 10. The first conductor pattern 20 comprises: a first nickel plating layer 210 which is provided on the one main surface of the glass plate 10 and has a phosphorus content of 5% by mass or less; and a first copper plating layer 22 which is provided on the first nickel plating layer 210.
Inventors:
TSUCHIDA TETSUYUKI (JP)
Application Number:
PCT/JP2017/043677
Publication Date:
June 14, 2018
Filing Date:
December 05, 2017
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD (JP)
International Classes:
H05K1/09; H01L23/12; H01L23/15; H05K1/16
Foreign References:
| JP2014022465A | 2014-02-03 | |||
| JPH1056247A | 1998-02-24 | |||
| JP2005026670A | 2005-01-27 | |||
| JP2016152397A | 2016-08-22 | |||
| JP2006147971A | 2006-06-08 | |||
| JP2000252630A | 2000-09-14 | |||
| JP2003166974A | 2003-06-13 |
Other References:
See also references of EP 3554200A4
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
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