Title:
CORELESS SUBSTRATE PREPREG, CORELESS SUBSTRATE, CORELESS SUBSTRATE MANUFACTURING METHOD AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/181516
Kind Code:
A1
Abstract:
Provided are: a coreless substrate prepreg; and a coreless substrate, a coreless substrate manufacturing method, and a semiconductor package which use said prepreg. The coreless substrate prepreg comprises a thermosetting resin composition containing: (a) a (meta)acrylic elastomer; (b) an amine compound having at least two primary amino groups; and (c) a maleimide compound having at least two N-substituted maleimide groups.
Inventors:
SAKAMOTO NORIHIKO (JP)
YOKOTA HIROSHI (JP)
HASHIMOTO SHINTARO (JP)
NAWATE KATSUHIKO (JP)
TSUCHIKAWA SHINJI (JP)
TAKANEZAWA SHIN (JP)
YOKOTA HIROSHI (JP)
HASHIMOTO SHINTARO (JP)
NAWATE KATSUHIKO (JP)
TSUCHIKAWA SHINJI (JP)
TAKANEZAWA SHIN (JP)
Application Number:
PCT/JP2018/012846
Publication Date:
October 04, 2018
Filing Date:
March 28, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B32B5/28; C08J5/24; B32B15/08; C08G59/50; C08K5/17; C08K5/3415; C08L33/04; H05K1/03; H05K3/46
Domestic Patent References:
| WO2014132947A1 | 2014-09-04 |
Foreign References:
| JP2016190966A | 2016-11-10 | |||
| JP2016196549A | 2016-11-24 | |||
| JP2014146761A | 2014-08-14 |
Other References:
TAKAGI KIYOSHI: "Recent Trend of Printed Wire Board technology", GICHO BUSINESS COMMUNICATIONS INC., 11 May 2015 (2015-05-11), Retrieved from the Internet [retrieved on 20180608]
Attorney, Agent or Firm:
HIRASAWA, Kenichi et al. (JP)
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