Title:
CORROSION AND MOISTURE RESISTANT COPPER BASED BONDING WIRE COMPRISING NICKEL
Document Type and Number:
WIPO Patent Application WO/2016/105276
Kind Code:
A8
Abstract:
A wire comprising a core comprising or consisting of (a) nickel in an amount in the range of from 0.005 to 5 wt.-%, (b) optionally, silver in an amount in the range of from 0.005 to 1 wt.-%, (c) copper in an amount in the range of from 94 wt.-% to 99.98 wt.-%, and (d) 0 to 100 wt.-ppm of further components, wherein all amounts in wt.-% and wt.-ppm are based on the total weight of the core, wherein the core has an average size of crystal grains in the range of from 1.5 to 30 μm, the average size determined according to the line intercept method, wherein the wire has an average diameter in the range of from 8 to 80 μm.
Inventors:
LIAO JIN ZHI (SG)
ZHANG XI (SG)
SARANGAPANI MURALI (SG)
VINOBAJI SURESHKUMAR (SG)
PHYU PHYU THEINT EI (SG)
TOK CHEE WEI (SG)
ZHANG XI (SG)
SARANGAPANI MURALI (SG)
VINOBAJI SURESHKUMAR (SG)
PHYU PHYU THEINT EI (SG)
TOK CHEE WEI (SG)
Application Number:
PCT/SG2015/000142
Publication Date:
June 29, 2017
Filing Date:
November 26, 2015
Export Citation:
Assignee:
HERAEUS MATERIALS SINGAPORE PTE LTD (SG)
International Classes:
C22C9/00; B32B15/01; C22C9/06; C22F1/08; C23C28/00
Attorney, Agent or Firm:
DREW & NAPIER LLC (SG)
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