Title:
COUPLING STRUCTURE FOR DUAL TYPE TEMPERATURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2013/151343
Kind Code:
A1
Abstract:
The present invention relates to a connector type coupling apparatus for a temperature sensor and, more specifically, to an apparatus which comprises a temperature sensor fixed inside a device corresponding to a measuring object and a power supply unit for supplying power and enables selective use of the temperature sensor, as necessary, by using an external jumper connector. The present invention comprises: a measurement unit which is fixed inside the device corresponding to the measuring object and measures the peripheral temperature; the power supply unit for supplying power to the measurement unit; and a MICOM for adjusting the temperature by receiving an electrical signal according to a change of the temperature measured through the measurement unit.
Inventors:
LEE JE HEON (KR)
Application Number:
PCT/KR2013/002796
Publication Date:
October 10, 2013
Filing Date:
April 04, 2013
Export Citation:
Assignee:
N N SCIENCE CO LTD (KR)
International Classes:
G01K1/14; F25D29/00; G01K7/22
Foreign References:
| JP2006156257A | 2006-06-15 | |||
| JP2008009242A | 2008-01-17 | |||
| JPH0942748A | 1997-02-14 | |||
| KR200351516Y1 | 2004-05-22 |
Attorney, Agent or Firm:
HWANG MOK PARK IP GROUP (KR)
특허법인 충정 (KR)
특허법인 충정 (KR)
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