Title:
COUPLING SUBSTRATE FOR SEMICONDUCTOR COMPONENTS AND METHOD FOR THE PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO2005091365
Kind Code:
A3
Abstract:
The invention relates to a coupling substrate (3) for semiconductor components comprising a structural metal layer (4) on the topside (5) of an insulating support (6). Metal strips (7) raised over the insulating support are angled in the direction of the lower side (10) of the support (6) on the lateral edges (8, 9) thereof and are extended over said lower side (10) of the support. The metal strips (7) are provided with a metal coating (11) whose cross section can be increased in such a way that said metal strips (7) form external contacts (12) for the flat electric conductor of the coupling substrate (3).
Inventors:
POHL JENS (DE)
Application Number:
PCT/DE2005/000468
Publication Date:
March 16, 2006
Filing Date:
March 15, 2005
Export Citation:
Assignee:
INFINEON TECHNOLOGIES AG (DE)
POHL JENS (DE)
POHL JENS (DE)
International Classes:
H01L23/498; H01L25/065; H01L25/10; H05K1/14; H05K3/40; H05K3/00; H05K3/24; H05K3/28; H05K3/34; (IPC1-7): H01L25/10; H01L23/498
Foreign References:
| US20030020154A1 | 2003-01-30 | |||
| US20030221313A1 | 2003-12-04 | |||
| US4953005A | 1990-08-28 | |||
| US20030111736A1 | 2003-06-19 | |||
| US6359236B1 | 2002-03-19 | |||
| US6084780A | 2000-07-04 | |||
| DE10138278C1 | 2003-04-03 |
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