Title:
COVER COUPLING STRUCTURE FOR HOUSING OF ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/083322
Kind Code:
A1
Abstract:
The electronic apparatus, according to various embodiments of the present disclosure, comprises a housing defining the exterior of the electronic apparatus, a cover which, with the housing, defines at least part of the exterior of the electronic apparatus, and a coupling structure arranged on the housing and configured to detachably couple the cover to the housing, wherein the coupling structure may comprise an opening, a screw coupling structure located inside the opening, a connection part for connecting the perimeters of the screw coupling structure and the opening, and one or more hooking protrusions protruding from the perimeter of the opening towards the screw coupling structure, and wherein the cover may comprise a hook configured to be hooked to the one or more hooking protrusions.
Inventors:
KIM EU GENE (KR)
Application Number:
PCT/KR2018/012829
Publication Date:
May 02, 2019
Filing Date:
October 26, 2018
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K5/00; G06F1/16; H05K5/03
Foreign References:
| KR20170003079U | 2017-09-01 | |||
| JP2013166551A | 2013-08-29 | |||
| KR200419349Y1 | 2006-06-20 | |||
| US20090159411A1 | 2009-06-25 | |||
| US20110297806A1 | 2011-12-08 |
Attorney, Agent or Firm:
KWON, Hyuk-Rok et al. (KR)
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