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Title:
COVER FILM AND ELECTRONIC COMPONENT PACKAGE
Document Type and Number:
WIPO Patent Application WO/2015/029867
Kind Code:
A1
Abstract:
 Disclosed are: a cover film in which a base material layer, an intermediate layer, a peeling layer, and a heat seal layer are disposed in the stated order, wherein the peeling layer contains a resin composition essentially comprising 50-80 mass% of one or more copolymers selected from styrene-diene block copolymers and styrene-diene graft copolymers, and 50-20 mass% of an ethylene-α-olefin copolymer, the Vicat softening temperature is 55-80°C, and the heat seal layer contains a styrene-(meth)acrylate copolymer having a styrene content of 50-80 mass%; and an electronic component package using the cover film as a carrier tape lid.

Inventors:
TOYOTA WATARU (JP)
TOKUNAGA HISATSUGU (JP)
IWASAKI TAKAYUKI (JP)
SASAKI AKIRA (JP)
SUGIMOTO KAZUYA (JP)
Application Number:
PCT/JP2014/071865
Publication Date:
March 05, 2015
Filing Date:
August 21, 2014
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KK (JP)
International Classes:
B65D73/02; B32B27/00; B32B27/30; B32B27/32; B65D65/40; B65D85/86
Domestic Patent References:
WO2012137630A12012-10-11
WO2011010453A12011-01-27
WO2012169387A12012-12-13
WO2009081622A12009-07-02
Foreign References:
JP2007090725A2007-04-12
JP2010023429A2010-02-04
JPH11278582A1999-10-12
JPH0695303A1994-04-08
JP2006232405A2006-09-07
JP2007308143A2007-11-29
JP2000033673A2000-02-02
JPH11198299A1999-07-27
JP2000006329A2000-01-11
JP2002086637A2002-03-26
JP2005178811A2005-07-07
Attorney, Agent or Firm:
SONODA Yoshitaka et al. (JP)
Yoshitaka Sonoda (JP)
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