Title:
COVER FILM FOR FLEXIBLE PRINTED CIRCUIT AND FLEXIBLE PRINTED CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2019/194208
Kind Code:
A1
Abstract:
A cover film for a flexible printed circuit according to an embodiment of the present disclosure comprises an adhesive layer and a protecting layer to be laminated on a surface of the adhesive layer, and a laminate temperature region where the ratio of the viscosity of the protecting layer to that of the adhesive layer is 5 or more lies within a temperature range of 50°C-150°C.
Inventors:
HITOTSUMATSU TAKUMA (JP)
KASHIHARA HIDEKI (JP)
KASHIHARA HIDEKI (JP)
Application Number:
PCT/JP2019/014722
Publication Date:
October 10, 2019
Filing Date:
April 03, 2019
Export Citation:
Assignee:
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H05K3/28; B32B15/08
Foreign References:
| JP2006285178A | 2006-10-19 |
Attorney, Agent or Firm:
MORITA Takeshi et al. (JP)
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