Title:
COVER MEMBER, METHOD FOR PRODUCING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/225511
Kind Code:
A1
Abstract:
This cover member (80t) comprises a substrate part (81) and a sealing part (70t). The sealing part (70t) is provided on the substrate part (81), and is formed from a thermosetting bonding material. The sealing part (70t) comprises: a base layer (71) that is provided on the substrate part (81) and is in a cured state; and a bonding layer (72t) that is provided on the base layer (71) and is in a semi-cured state.
Inventors:
TAKAHASHI EIJI (JP)
ARAKAWA FUMIHIKO (JP)
ARAKAWA FUMIHIKO (JP)
Application Number:
PCT/JP2018/019804
Publication Date:
December 13, 2018
Filing Date:
May 23, 2018
Export Citation:
Assignee:
NGK ELECTRONICS DEVICES INC (JP)
NGK INSULATORS LTD (JP)
NGK INSULATORS LTD (JP)
International Classes:
H01L23/02; H01L23/10
Foreign References:
JP2004015604A | 2004-01-15 | |||
JPH03135051A | 1991-06-10 | |||
JP2014053512A | 2014-03-20 | |||
JPS61276239A | 1986-12-06 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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