Title:
COVER PLATE FLIP CHIP INTEGRATED APPARATUS FOR EXCITING SINGLE CRYSTAL TO EMIT WHITE LIGHT
Document Type and Number:
WIPO Patent Application WO/2017/197921
Kind Code:
A1
Abstract:
A cover plate flip chip LED integrated apparatus, consisting of a substrate (1), a conducting circuit layer (2), a glue dam (3), and a plurality of chip units which are distributed in a spaced manner. Each chip unit consists of a welding layer (4), a flip chip (5), an adhesive layer (6), and a cover plate layer (7) sequentially from bottom to top. The conducting circuit layer is located on the substrate or passes through the substrate to be located beneath the substrate. By bonding LED flip chips to bonding pads on a substrate, and providing discrete cover plates on the LED flip chips, the use of fluorescent powder and silica gel is avoided, so that the light emitting efficiency of the LED is improved, the attenuation of the LED chips can be reduced, and the service life of the LED can be prolonged.
Inventors:
CAO YONGGE (CN)
SHEN XIAOFEI (CN)
MA CHAOYANG (CN)
SHEN XIAOFEI (CN)
MA CHAOYANG (CN)
Application Number:
PCT/CN2017/072189
Publication Date:
November 23, 2017
Filing Date:
January 23, 2017
Export Citation:
Assignee:
UNIV RENMIN CHINA (CN)
International Classes:
H01L33/50; C09K11/80
Foreign References:
| CN105826454A | 2016-08-03 | |||
| CN106298755A | 2017-01-04 | |||
| CN205645870U | 2016-10-12 | |||
| CN106270523A | 2017-01-04 | |||
| CN104818024A | 2015-08-05 | |||
| CN102730980A | 2012-10-17 |
Attorney, Agent or Firm:
JEEKAI & PARTNERS (CN)
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