Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COVER PLATE, METHOD FOR MANUFACTURING COVER PLATE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/028419
Kind Code:
A1
Abstract:
A cover plate, a method of manufacturing the cover plate, and an electronic device having the cover plate are provided. The cover plate includes a substrate, at least one slot defined in the substrate and penetrating through the substrate, and a filling layer received in the slot and including an insulating layer and a gel layer located on the insulating layer.

More Like This:
JP4444394battery
JP2008112603BATTERY
Inventors:
LI JING (CN)
YANG GUANGMING (CN)
GONG QINGGUO (CN)
Application Number:
PCT/CN2017/094061
Publication Date:
February 15, 2018
Filing Date:
July 24, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD (CN)
International Classes:
H01M2/04; H05K5/04
Foreign References:
CN105813422A2016-07-27
CN105149184A2015-12-16
CN105517389A2016-04-20
CN205992550U2017-03-01
CN106159132A2016-11-23
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: ONLINE TRANSACTION METHOD, VISUAL FINANCIAL IC CARD, CLIENT, AND SERVER

Next Patent: POLYCRYSTALLINE FORM OF DEHYDROPHENYLAHISTIN-LIKE COMPOUND, AND MANUFACTURING AND PURIFICATION METHO...