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Title:
COVER PLATE, METHOD FOR MANUFACTURING COVER PLATE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/134132
Kind Code:
A1
Abstract:
A cover plate (100), a method for manufacturing the cover plate (100), and an electronic apparatus (200). The cover plate (100) comprises: a substrate (10), a bonding layer (20), a base material layer (30), a first texture layer (40) and an ink layer (60), wherein the substrate (10) comprises a first surface (11) and a second surface (12), which are opposite each other; a second texture layer (13) is formed on the second surface (12); and the bonding layer (20), the base material layer (30), the first texture layer (40), a plating layer (50) and the ink layer (60) are sequentially disposed on the first surface (11).

Inventors:
LIU, Wei (No.18 Fu Ying Road, Changbei Economic and Technological Development ZoneNanchang, Jiangxi 3, 330013, CN)
TANG, Bin (No.18 Fu Ying Road, Changbei Economic and Technological Development ZoneNanchang, Jiangxi 3, 330013, CN)
Application Number:
CN2018/071627
Publication Date:
July 11, 2019
Filing Date:
January 05, 2018
Export Citation:
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Assignee:
NANCHANG O-FILM OPTICAL TECHNOLOGY CO., LTD (No.18 Fu Ying Road, Changbei Economic and Technological Development ZoneNanchang, Jiangxi 3, 330013, CN)
International Classes:
H04M1/02; G06F3/041
Domestic Patent References:
WO2017030046A12017-02-23
Foreign References:
CN107835276A2018-03-23
CN207304637U2018-05-01
CN205686055U2016-11-16
CN205015859U2016-02-03
CN206684337U2017-11-28
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (Room 301 Trade Building, ZhaolanyuanTsinghua University, Qinghuayuan, Haidian District, Beijing 4, 100084, CN)
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