Title:
COVER TAPE AND ELECTRONIC COMPONENT PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/235606
Kind Code:
A1
Abstract:
A cover tape (10) for packaging of electronic components, provided with a substrate layer (3) and an intermediate layer (1) laminated on the one face of the substrate layer (3). A dimension of the intermediate layer (1) at 23˚C being T0 and the dimension thereof after two hours of heating at 80˚C being T1, the dimensional change rate of the cover tape (10), expressed by the following equation (1), is -4% to 4% in the flow direction (MD) and 0% to 2% in the width direction (TD) of the intermediate layer. Equation (1): Dimensional change rate (%)=[(T0 - T1)/T0]x100
Inventors:
HIRAMATSU MASAYUKI (JP)
ABE HIROKI (JP)
ABE HIROKI (JP)
Application Number:
PCT/JP2018/021799
Publication Date:
December 27, 2018
Filing Date:
June 07, 2018
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B65D73/02; B65D85/38
Foreign References:
| JP2014031197A | 2014-02-20 | |||
| JP2010076832A | 2010-04-08 | |||
| JP2017013803A | 2017-01-19 | |||
| JP2002104501A | 2002-04-10 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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