COVER TAPE FOR ELECTRONIC COMPONENT PACKAGING AND PACKAGE FOR ELECTRONIC COMPONENTS

Title:

COVER TAPE FOR ELECTRONIC COMPONENT PACKAGING AND PACKAGE FOR ELECTRONIC COMPONENTS

Document Type and Number:

WIPO Patent Application WO/2016/143600

Kind Code:

A1

Abstract:

This cover tape for electronic component packaging comprises: a base layer; a sealant layer that is provided on one surface of the base layer; and an antistatic layer that is provided on a surface of the base layer, said surface being on the reverse side of the above-described one surface. If R50 is the surface resistivity of the surface of the antistatic layer as measured at 23°C at 50% RH and R30 is the surface resistivity of the surface of the antistatic layer as measured at 23°C at 30% RH, the value of R50/R30 is from 0.35 to 2.8 (inclusive).

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Inventors:

MORITOH RYOSUKE (JP)

Application Number:

PCT/JP2016/056200

Publication Date:

September 15, 2016

Filing Date:

March 01, 2016

Export Citation:

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Assignee:

SUMITOMO BAKELITE CO (JP)

International Classes:

B65D73/02; B65D85/86

Foreign References:

JP2002114267A	2002-04-16
JP2005178811A	2005-07-07

Attorney, Agent or Firm:

HAYAMI SHINJI (JP)
Shinji Hayami (JP)

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