Title:
COVER TAPE FOR ELECTRONIC PARTS PACKAGING
Document Type and Number:
WIPO Patent Application WO/2015/115338
Kind Code:
A1
Abstract:
Provided is a cover tape for electronic parts packaging that can be stably stored without blocking occurring and that can stably maintain the antistatic capability even when stored in a wound state for a long period in a high temperature environment of 60°C or in a high temperature-high humidity environment of approximately 40°C with 90% humidity, or that can control the occurrence of static caused by friction on the surface on the side opposite of the sealant layer surface. This cover tape for electronic parts packaging comprises a base material layer, a sealant layer provided on one surface of the base material layer, and a conductive polymer layer provided on the other face of the base material layer.
Inventors:
MORITOH RYOSUKE (JP)
Application Number:
PCT/JP2015/051933
Publication Date:
August 06, 2015
Filing Date:
January 23, 2015
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B65D85/86; B65D73/02
Foreign References:
| JP2002193377A | 2002-07-10 | |||
| JP2004058648A | 2004-02-26 | |||
| JP2005081766A | 2005-03-31 | |||
| JP2003128132A | 2003-05-08 | |||
| JP2000142788A | 2000-05-23 | |||
| JP2001301819A | 2001-10-31 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
Sumio Tanai (JP)
Sumio Tanai (JP)
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