Title:
COVER TAPE FOR PACKAGING ELECTRONIC PART AND ELECTRONIC PART PACKAGE
Document Type and Number:
WIPO Patent Application WO/2011/010453
Kind Code:
A1
Abstract:
Provided is a cover tape for packaging an electronic part, which is unlikely to become electrically charged and which has excellent transparency, and further provided is an electronic part package. A cover tape (100) consists of a plurality of layers including at least a base material layer (110) and a heat seal layer (140). Any two or more of these plurality of layers are laminated with an adhesive layer (120) interposed. The adhesive layer (120) contains an antistatic agent in an amount that is between 10 wt% and 70 wt% with respect to the adhesive layer (120). The antistatic agent contains an alkylene carbonate and surfactant as the primary components.
Inventors:
HIRAMATSU, Masayuki (5-8, Higashi-Shinagawa 2-chome, Shinagawa-k, Tokyo 02, 〒1400002, JP)
Application Number:
JP2010/004661
Publication Date:
January 27, 2011
Filing Date:
July 21, 2010
Export Citation:
Assignee:
SUMITOMO BAKELITE CO., LTD. (5-8 Higashi-Shinagawa 2-chome, Shinagawa-ku Tokyo, 02, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
住友ベークライト株式会社 (〒02 東京都品川区東品川２丁目５番８号 Tokyo, 〒1400002, JP)
International Classes:
B65D73/02; B32B7/12; B65D85/86; B65D65/40
Attorney, Agent or Firm:
CREIA IP ATTORNEYS (Dojima Building, 2-6-8 Nishitenma, Kita-ku, Osaka-sh, Osaka 47, 〒5300047, JP)
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