Title:
COVER TAPE
Document Type and Number:
WIPO Patent Application WO/2011/158550
Kind Code:
A1
Abstract:
Disclosed is a cover tape which comprises at least a base layer (A), an intermediate layer (B), a peeling layer (C), the primary component of which is a thermoplastic resin, and a heat seal layer (D), the primary component of which is a thermoplastic resin that can be heat sealed to a carrier tape. The tensile storage modulus (c) of the thermoplastic resin that constitutes the peeling layer (C) is within the range of 1×106 Pa to 1×108 Pa. The tensile storage modulus (d) of the thermoplastic resin that constitutes the heat seal layer (D) is within the range of 1×108 Pa to 1×1010 Pa. The ratio of (c) and (d) satisfies 1×104≥(d)/(c)≥1×10. This kind of cover tape has the appropriate peel strength and sufficiently low fluctuation in peel strength when heat sealed to a thermoplastic resin carrier tape. Therefore, the tape will not tear even under shock caused by high-speed peeling, and adherence of electronic parts does not occur even when set aside for a long period of time of 24 to 72 hours in a high-temperature environment of 60 to 80ºC.
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Inventors:
SASAKI Akira (245 Nishigawara, Naganuma-cho, Isesaki-sh, Gunma 55, 〒3720855, JP)
佐々木 彰 (〒55 群馬県伊勢崎市長沼町西河原２４５番地 電気化学工業株式会社 伊勢崎工場内 Gunma, 〒3720855, JP)
TOKUNAGA Hisatsugu (245 Nishigawara, Naganuma-cho, Isesaki-sh, Gunma 55, 〒3720855, JP)
佐々木 彰 (〒55 群馬県伊勢崎市長沼町西河原２４５番地 電気化学工業株式会社 伊勢崎工場内 Gunma, 〒3720855, JP)
TOKUNAGA Hisatsugu (245 Nishigawara, Naganuma-cho, Isesaki-sh, Gunma 55, 〒3720855, JP)
Application Number:
JP2011/059545
Publication Date:
December 22, 2011
Filing Date:
April 18, 2011
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA (1-1 Nihonbashi-Muromachi 2-chome, Chuo-ku Tokyo, 38, 〒1038338, JP)
電気化学工業株式会社 (〒38 東京都中央区日本橋室町二丁目１番１号 Tokyo, 〒1038338, JP)
SASAKI Akira (245 Nishigawara, Naganuma-cho, Isesaki-sh, Gunma 55, 〒3720855, JP)
佐々木 彰 (〒55 群馬県伊勢崎市長沼町西河原２４５番地 電気化学工業株式会社 伊勢崎工場内 Gunma, 〒3720855, JP)
電気化学工業株式会社 (〒38 東京都中央区日本橋室町二丁目１番１号 Tokyo, 〒1038338, JP)
SASAKI Akira (245 Nishigawara, Naganuma-cho, Isesaki-sh, Gunma 55, 〒3720855, JP)
佐々木 彰 (〒55 群馬県伊勢崎市長沼町西河原２４５番地 電気化学工業株式会社 伊勢崎工場内 Gunma, 〒3720855, JP)
International Classes:
B65D73/02; B32B27/18; B32B27/32; B65D65/02; B65D85/38
Attorney, Agent or Firm:
SONODA Yoshitaka et al. (SONODA & KOBAYASHI, 34th Floor Shinjuku Mitsui Building, 1-1, Nishi-Shinjuku 2-chome, Shinjuku-k, Tokyo 34, 〒1630434, JP)
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Claims: