Title:
COVER WITH RING FOR FOLDABLE ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/008944
Kind Code:
A1
Abstract:
A cover for a foldable electronic device is disclosed. The cover comprises: a first cover member and a second cover member, wherein the first cover member and the second cover member are spaced a certain interval from each other and are configured to be folded or unfolded with a folding axis interposed therebetween; an inner cover comprising a first area coupled to a first inner surface of the first cover member, a second area coupled to a second inner surface of the second cover member, and a third area connecting the first area and the second area and extending across the certain interval; and a ring coupled to the third area of the inner cover.
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Inventors:
KANG BOSOON (KR)
KIM NAMSU (KR)
LEE DAHYUN (KR)
JIN JUNHO (KR)
KIM NAMSU (KR)
LEE DAHYUN (KR)
JIN JUNHO (KR)
Application Number:
PCT/KR2022/011174
Publication Date:
February 02, 2023
Filing Date:
July 29, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
A45C11/00; A45C13/00; A45C15/00; H04B1/3888; H04M1/02
Foreign References:
| KR101956481B1 | 2019-03-08 | |||
| JP2002199070A | 2002-07-12 | |||
| KR20210047585A | 2021-04-30 | |||
| KR102161481B1 | 2020-10-05 | |||
| KR20170042939A | 2017-04-20 |
Attorney, Agent or Firm:
BAE, KIM & LEE IP (KR)
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