Title:
COVERED WIRE AND METHOD FOR PRODUCING COVERED WIRE
Document Type and Number:
WIPO Patent Application WO/2024/048191
Kind Code:
A1
Abstract:
The present invention provides a covered wire which comprises a rectangular wire base material and a cover layer that is formed on the outer circumference of the rectangular wire base material, wherein the cover layer comprises: a first layer that is formed of a liquid coating composition (1) that contains a polymer compound (1) which has one or both of an amide group and an imide group; a second layer that is formed of a liquid coating composition (2) that contains a fluorine-containing polymer compound (2) and a polymer compound (2) which has one or both of an amide group and an imide group, or alternatively, a second layer that is formed of a powder coating composition (2) that contains a fluorine-containing polymer compound (2) and a polymer compound (2) which has one or both of an amide group and an imide group; and a third layer that is formed by extrusion molding of a fluorine-containing polymer compound (3).
Inventors:
NAKATANI YASUKAZU (JP)
KONO HIDEKI (JP)
OGITA KOICHIRO (JP)
SUKEGAWA MASAMICHI (JP)
KONO HIDEKI (JP)
OGITA KOICHIRO (JP)
SUKEGAWA MASAMICHI (JP)
Application Number:
PCT/JP2023/028332
Publication Date:
March 07, 2024
Filing Date:
August 02, 2023
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
International Classes:
H01B7/02; H01B7/18; H01B13/16; H01B13/24; H01F5/06
Domestic Patent References:
| WO2019102989A1 | 2019-05-31 | |||
| WO2011024809A1 | 2011-03-03 |
Foreign References:
| JPS6329412A | 1988-02-08 | |||
| JPH11191325A | 1999-07-13 |
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
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