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Patent Searching and Data


Title:
COVERED-WIRE SEALER
Document Type and Number:
WIPO Patent Application WO/2015/088004
Kind Code:
A1
Abstract:
Provided is a wire sealer that exhibits satisfactory sealing properties and good seal processing workability. This radiation-curable wire sealer contains components (A)-(C), and a cured film obtained from the radiation-curable wire sealer exhibits an oil absorptivity of equal to or greater than 7 mass%, a water absorptivity of equal to or less than 10 mass%, and a Young's modulus of 2-500MPa. Components (A)-(C): (A) Urethane(meth)acrylate; (B) a compound containing one ethylenically unsaturated group, and not containing an anion dissociative group; and (C) a radiation polymerization initiator.

Inventors:
YAMAGUCHI HIROSHI (JP)
KONDOU KAZUYUKI (JP)
KUROSAWA TAKAHIKO (JP)
IMAI HIROKAZU (JP)
KOMIYA ZEN (JP)
Application Number:
PCT/JP2014/082989
Publication Date:
June 18, 2015
Filing Date:
December 12, 2014
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
C09K3/10; H01B7/00; H01B7/282; H02G15/04
Domestic Patent References:
WO2013022056A12013-02-14
Foreign References:
JP2013251166A2013-12-12
JP2012046664A2012-03-08
JP2008031189A2008-02-14
JP2010150517A2010-07-08
Attorney, Agent or Firm:
THE PATENT CORPORATE BODY ARUGA PATENT OFFICE (JP)
Patent business corporation Alga patent firm (JP)
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