Title:
COVERING ASSEMBLY FOR PLASMA PROCESSING CHAMBER
Document Type and Number:
WIPO Patent Application WO/2019/066168
Kind Code:
A1
Abstract:
The present invention relates to a covering assembly for encompassing an electrostatic chuck in a plasma processing chamber formed to alleviate surface damage and feature profile tilting of a semiconductor substrate. The present invention relates to a covering assembly for a plasma processing chamber, the covering assembly being formed to encompass an electrostatic chuck having an upper end surface, which supports a substrate, and a stepped annular step at the upper end surface, and comprising: a quartz ring arranged in the annular step of the electrostatic chuck so as to encompass the side surfaces of the substrate and the electrostatic chuck, and having a coupling groove formed on the lower surface thereof; and an electrode ring coupled to the coupling groove of the quartz ring so as to maintain electrical contact with the electrostatic chuck on the horizontal plane of the annular step, wherein the quartz ring has an internal transmittance of 99% or greater. According to the present invention, the surface damage and feature profile tilting of the semiconductor substrate can be alleviated.
Inventors:
KIM DON HAN (KR)
Application Number:
PCT/KR2018/002960
Publication Date:
April 04, 2019
Filing Date:
March 14, 2018
Export Citation:
Assignee:
BCNC CO LTD (KR)
International Classes:
H01L21/683; H01L21/67
Foreign References:
| JP2017055100A | 2017-03-16 | |||
| KR20130136451A | 2013-12-12 | |||
| JP2012227278A | 2012-11-15 | |||
| KR20100050113A | 2010-05-13 | |||
| KR20080102926A | 2008-11-26 |
Attorney, Agent or Firm:
KIM, Kyung Hwan (KR)
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