Title:
COVERING STENCIL AND COVERING STENCIL UNIT
Document Type and Number:
WIPO Patent Application WO/2004/105452
Kind Code:
A1
Abstract:
The invention relates to a covering stencil (10) for covering substrates, particularly printed circuit boards, comprising openings (12) via which materials, particularly solder paste and/or adhesive, can be applied to the substrate in a specific manner. The covering stencil also comprises retaining sections (18) in the edge area (16) for fixing in a retaining frame of the covering stencil (10) with a fixing device. The invention is characterized in that the covering stencil (10), at least in the middle film area that contains the openings (12), is formed from a thin film material (14), and that the edge area (16) comprising the retaining sections (18) has, with regard to the middle area, a reinforcement (22) that enables the fixing. The invention also relates to a covering stencil unit comprising a covering stencil (10) and retaining frame of the aforementioned type.
Inventors:
PRIESSNITZ WALTER JUN (ES)
ABRIL-PRIESSNITZ YOLANDA (ES)
ABRIL-PRIESSNITZ YOLANDA (ES)
Application Number:
PCT/EP2003/011304
Publication Date:
December 02, 2004
Filing Date:
October 13, 2003
Export Citation:
Assignee:
PRIESSNITZ WALTER JUN (ES)
ABRIL-PRIESSNITZ YOLANDA (ES)
ABRIL-PRIESSNITZ YOLANDA (ES)
International Classes:
B41N1/24; H05K3/12; B41C1/14; (IPC1-7): H05K3/12; B41F15/36; B41N1/24
Domestic Patent References:
| WO2003093012A1 | 2003-11-13 |
Foreign References:
| DE20121710U1 | 2003-04-24 | |||
| DE2531549A1 | 1977-01-20 | |||
| US3769908A | 1973-11-06 | |||
| DE20022697U1 | 2002-05-23 | |||
| US5979312A | 1999-11-09 | |||
| DE20209385U1 | 2002-08-29 | |||
| EP0719638A2 | 1996-07-03 | |||
| US6253675B1 | 2001-07-03 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 011, no. 243 (P - 603) 8 August 1987 (1987-08-08)
Attorney, Agent or Firm:
Bulling, Dr. Alexander (Fuhlendorf Steimle & Becke, Postfach 10 37 62 Stuttgart, DE)
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