Title:
COVERLAY FILM, FLEXIBLE PRINTED CIRCUIT BOARD USING SAME, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2014/064986
Kind Code:
A1
Abstract:
The coverlay film of the present invention comprises (A) a specific vinyl compound, (B) a polystyrene-poly(ethylene/butylene) block copolymer, (C) a polystyrene-poly(ethylene-ethylene/propylene) block copolymer, (D) an epoxy resin, and (E) a bismaleimide. The mass ratio of each component satisfies (A+E)/(B+C) = 0.81-1 and (B)/(C) = 1-4. An adhesive layer containing 1-10 mass% of the component (D) with respect to the total mass of the components (A)-(E) is formed on one surface of an organic film having a melting point that is higher than the thermal curing temperature of the adhesive layer, a dielectric constant of 4 or less in an area having a frequency of 1-10 GHz, and a dielectric loss tangent of 0.02 or less.
Inventors:
KUWANO HIROSHI (JP)
TERAKI SHIN (JP)
TERAKI SHIN (JP)
Application Number:
PCT/JP2013/071514
Publication Date:
May 01, 2014
Filing Date:
August 08, 2013
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
H05K3/28; B32B27/00; B32B27/30; C08K5/3415; C08L53/00; C08L63/00; C08L71/12; C09J153/02; C09J163/00; C09J171/00
Domestic Patent References:
| WO2013099172A1 | 2013-07-04 |
Foreign References:
| JP2011068713A | 2011-04-07 | |||
| JP2009161725A | 2009-07-23 |
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
Mochitoshi Watanabe (JP)
Download PDF:
Previous Patent: SYSTEM FOR UNIFIED QUANTITATIVE DETERMINATION OF VARIOUS FORMS OF CARBON AND NITROGEN WHICH EMPLOYS ...
Next Patent: FILTER DEVICE
Next Patent: FILTER DEVICE