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Title:
COVERS FOR ELECTRONIC DEVICES
Document Type and Number:
WIPO Patent Application WO/2021/138840
Kind Code:
A1
Abstract:
Provided are covers (100) for electronic devices, methods of making the covers (100) and electronic devices. The method comprises the steps of: forming an enclosure with a metal substrate; joining the light metal substrate with an insert molding plastic part; applying a degreasing treatment composition to at least one surface of the metal substrate; forming a first micro-arc oxidation layer on the degreased surface of the metal substrate; applying a first primer coating on the micro-arc oxidation layer; polishing the first primer coating; applying an optional second micro-arc oxidation layer on the polished primer coating; applying an optional second primer coating on the second micro-arc oxidation layer; and then applying an optional base coating and then an optional top coating.

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Inventors:
GUO QINGYONG (CN)
XU YONGYONG (CN)
ZHU XIAOJUN (CN)
LI YONGJUN (CN)
WU KUANTING (CN)
Application Number:
PCT/CN2020/070931
Publication Date:
July 15, 2021
Filing Date:
January 08, 2020
Export Citation:
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Assignee:
HEWLETT PACKARD DEVELOPMENT CO (US)
GUO QINGYONG (CN)
XU YONGYONG (CN)
ZHU XIAOJUN (CN)
LI YONGJUN (CN)
WU KUANTING (CN)
International Classes:
H05K5/04; C25D11/02; H05K5/00; H05K5/02
Foreign References:
CN107079599A2017-08-18
CN101883477A2010-11-10
CN101730415A2010-06-09
CN101573009A2009-11-04
CN110560346A2019-12-13
CN104812192A2015-07-29
CN105992478A2016-10-05
US20180049337A12018-02-15
KR20180062733A2018-06-11
Attorney, Agent or Firm:
CHINA PATENT AGENT (H.K.) LTD. (CN)
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