Cr-Cu ALLOY, PROCESS FOR PRODUCING THE SAME, HEAT SINK FOR SEMICONDUCTOR, AND HEAT DISSIPATING COMPONENT FOR SEMICONDUCTOR

Title:

Cr-Cu ALLOY, PROCESS FOR PRODUCING THE SAME, HEAT SINK FOR SEMICONDUCTOR, AND HEAT DISSIPATING COMPONENT FOR SEMICONDUCTOR

Document Type and Number:

WIPO Patent Application WO/2007/094507

Kind Code:

A1

Abstract:

This invention provides a Cr-Cu alloy comprising a Cu matrix and a flat Cr phase and produced by powder metallurgy, and a process for producing the same. In the Cr-Cu alloy and production process of the Cr-Cu alloy, the content of Cr in the Cr-Cu alloy is brought to more than 30% by mass and not more than 80% by mass, and the average aspect ratio of the flat Cr phase is brought to more than 1.0 and less than 100. The Cr-Cu alloy thus produced has a small coefficient of thermal expansion in an in-plane direction, has a large coefficient of thermal conductivity, and has excellent workability. There are also provided a heat sink for a semiconductor and a heat dissipating component for a semiconductor, using the Cr-Cu alloy.

Inventors:

OTA HIROKI (JP)
KOBIKI HIDEAKI (JP)
UENOSONO SATOSHI (JP)
TERAO HOSHIAKI (JP)

Application Number:

PCT/JP2007/053128

Publication Date:

August 23, 2007

Filing Date:

February 14, 2007

Export Citation:

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Assignee:

JFE STEEL CORP (JP)
JFE PREC CORP (JP)
OTA HIROKI (JP)
KOBIKI HIDEAKI (JP)
UENOSONO SATOSHI (JP)
TERAO HOSHIAKI (JP)

International Classes:

C22C9/00; B21B3/00; B22F3/26; C22C1/08; C22C27/06; H01L23/373

Foreign References:

JP2005330583A	2005-12-02
JPH09324230A	1997-12-16

Other References: