Title:
CRACK FREE WELDING OF SILICON
Document Type and Number:
WIPO Patent Application WO2002070184
Kind Code:
B1
Abstract:
A method and apparatus for welding together two silicon workpieces (20, 22) without the formation of cracks along the weld. In a first embodiment, current (34, 36) is passed through one or both of the workpieces to heat them to between 600 and 900 DEG C. Then an electric, laser, or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. In a second embodiment, current (34) is passed through a plate (60), preferably formed of silicon, which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.
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Inventors:
ZEHAVI RAANAN Y
DAVIS ROBERT L
ACKARD DAVID B
GOVORKO JAMES W
DAVIS ROBERT L
ACKARD DAVID B
GOVORKO JAMES W
Application Number:
PCT/US2001/051433
Publication Date:
March 13, 2003
Filing Date:
November 07, 2001
Export Citation:
Assignee:
INTEGRATED MATERIALS INC (US)
International Classes:
B23K10/02; (IPC1-7): B23K9/00; B23K26/00; B23K9/23; B23K26/32
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