CREEP-PREVENTING PTFE SHEET USED FOR DIE MOUNTING, AND METHOD FOR MOUNTING DIE

WIPO Patent Application WO/2019/107419

A1

A PTFE sheet (44) spun from PTFE fibers having a diameter of no more than 1 μm, the PTFE sheet (44) having a Gurley value in the range of 1 to 3 and a shrinkage factor in a direction orthogonal to a sheet winding direction of no more than 10% when heated to 300 °C. The PTFE sheet (44) makes a die (100) adsorbable via a tool (22), which is for heating the die (100) when the die (100) is mounted on a mounted body (110), by being sandwiched between the die (100) and the tool (22), and suppresses the adhesion, to an adsorption surface (24) of the tool (22) or to the die (100), of an adhesion member (114) for fixing the die (100) to the mounted body (110). Through this configuration, a PTFE sheet capable of stabilizing vacuum adsorption and improving maintainability and a method for mounting a die are provided.

JP6386936	Manufacturing method of electrode members for pressure-welded semiconductor devices
JP5593529	Black zirconia reinforced alumina ceramics and a manufacturing method for the same
JP3744771	MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

WATANABE OSAMU (JP)
NAKAMURA TOMONORI (JP)
HAGIWARA YOSHIHITO (JP)
KANAI YUJI (JP)

PCT/JP2018/043802

June 06, 2019

November 28, 2018

Click for automatic bibliography generation  

SHINKAWA KK (JP)
VALQUA LTD (JP)

H01L21/52

JP2012044071A	2012-03-01
JP2006066767A	2006-03-09
JP2006066625A	2006-03-09

INABA, Yoshiyuki et al. (JP)

View/Download PDF      PDF Help

Previous Patent: PIERCING MACHINE AND METHOD FOR MANUFACTURING SEAMLESS METALLIC TUBE USING SAME

Next Patent: EQUIPMENT MANAGEMENT SYSTEM