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Title:
CRIMPED STRUCTURE, CRIMPING METHOD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/137043
Kind Code:
A1
Abstract:
A crimped structure wherein an inside member and an outside member are joined to each other. The inside member includes an insertion part (17) having a cylindrical outer circumferential surface (17S), and an annular groove (17U) provided in the outer circumferential surface (17S). The outside member includes a main body part (34), and a tubular part (33) formed continuous with the main body part and forming an opening (33K) into which the insertion part (17) is inserted. The tubular part (33) has a first reduced-diameter section (31), which is formed continuous with the main body part via a first plastic deformation section (31C), and is positioned more to the inside in the radial direction than the main body part by the plastic deformation of the first plastic deformation section, and a second reduced-diameter section (32), which is formed continuous with the first reduced-diameter section via a second plastic deformation section (32C), and is positioned more to the inside in the radial direction than the first reduced-diameter section by the plastic deformation of the second plastic deformation section. At least a portion of the second reduced-diameter section (32) intrudes into the annular groove (17U). The occurrence of localized deformation can be suppressed when crimping is performed.

Inventors:
TERAMOTO EIJI (JP)
HAKATA TOMOYUKI (JP)
NAKANO HITOSHI (JP)
NISHIKAWA KAZUYOSHI (JP)
Application Number:
PCT/JP2015/054076
Publication Date:
September 17, 2015
Filing Date:
February 16, 2015
Export Citation:
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Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
B21D39/04; B21D41/04; B21D53/00
Foreign References:
JP2006000873A2006-01-05
JPH10274216A1998-10-13
JPS5588939A1980-07-05
JP2004072924A2004-03-04
US20120139237A12012-06-07
US20060145474A12006-07-06
Other References:
See also references of EP 3117919A4
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
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