Title:
CRYOPUMP
Document Type and Number:
WIPO Patent Application WO/2005/050018
Kind Code:
A1
Abstract:
A cryopump (20) used in a process chamber (10) allowing a process gas to flow therein, comprising a 1st stage panel, a heat shield plate (24), and a 2nd stage panel (28). A cutout for enabling the inflow of gas molecules into the pump and an additional shield (34) for preventing the entry of heat by radiation from a cryopump container under room temperature are provided to the heat shield plate (24) to prevent the performance of the cryopump from being lowered by the process gas invading between the cryopump container and the heat shield plate.
Inventors:
TANAKA HIDEKAZU (JP)
Application Number:
PCT/JP2004/017052
Publication Date:
June 02, 2005
Filing Date:
November 17, 2004
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
TANAKA HIDEKAZU (JP)
TANAKA HIDEKAZU (JP)
International Classes:
F04B37/08; (IPC1-7): F04B37/08
Foreign References:
| JPS60222572A | 1985-11-07 | |||
| JPH07507855A | 1995-08-31 |
Attorney, Agent or Firm:
Takaya, Satoshi (10-12 Yoyogi 2-chom, Shibuya-ku Tokyo, JP)
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