Title:
CSP PACKAGING STRUCTURE TIGHTLY FITTING CHIP, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/223487
Kind Code:
A1
Abstract:
Disclosed are a CSP packaging structure tightly fitting a chip and a manufacturing method therefor. The CSP packaging structure comprises an LED chip and a symmetrical non-transparent fluorescent layer cladded over a top face and side face of the LED chip, wherein the symmetrical non-transparent fluorescent layer is tightly cladded over the top face and side face of the LED chip, and the thickness of the symmetrical non-transparent fluorescent layer located at the side face of the LED chip gradually decreases from top to bottom, and the symmetrical non-transparent fluorescent layer located at the top face of the LED chip has a rectangular orthogonal projection. The advantages of the present invention are that: a thin tightly fitting fluorescent powder layer of the CSP packaging structure tightly fitting a chip effectively reduces the temperature of the powder body, improves the heat dissipation performance of a light-emitting chip, and facilitates the accurate carrying out of a subsequent fitting process. Only a bottom thin fluorescent powder layer is joined, facilitating the accurate cutting and sorting of the chip. The symmetrical structure facilitates forming a good light shape with uniform light emission. The fabricating process is simple and stable, and is low in cost; and the packaging efficiency and device yield are greatly improved.
Inventors:
HE JIAQI (CN)
WANG SHUCHANG (CN)
SUN ZHIJIANG (CN)
WANG SHUCHANG (CN)
SUN ZHIJIANG (CN)
Application Number:
PCT/CN2019/084100
Publication Date:
November 28, 2019
Filing Date:
April 24, 2019
Export Citation:
Assignee:
DURA CHIP NANTONG LTD (CN)
International Classes:
H01L33/48; H01L33/50
Foreign References:
| CN106981554A | 2017-07-25 | |||
| CN105161598A | 2015-12-16 | |||
| CN105047786A | 2015-11-11 | |||
| CN106384775A | 2017-02-08 | |||
| US20140217443A1 | 2014-08-07 | |||
| US20160057833A1 | 2016-02-25 |
Download PDF: