Title:
Cu ALLOY FILM, AND DISPLAY DEVICE AND ELECTRONIC DEVICE EACH EQUIPPED WITH SAME
Document Type and Number:
WIPO Patent Application WO/2012/132871
Kind Code:
A1
Abstract:
The present invention provides a novel Cu alloy film which has high adhesion to a substrate and/or an insulation film and exhibits low electric resistivity even after undergoing a thermal treatment. The present invention relates to a Cu alloy film which contacts with a substrate and/or an insulation layer directly on the substrate, wherein the Cu alloy film comprises a Cu-Mn-X alloy layer (a first layer) that contains an element X (Ag, Au, C, W, Ca, Mg, Al, Sn, B and/or Ni) and a layer (a second layer) that comprises pure Cu or a Cu alloy mainly composed of Cu and having lower electric resistivity than that of the first layer, and wherein the first layer and the second layer are arranged in this order when observed from the substrate side.
Inventors:
TOMIHISA KATSUFUMI
MIKI AYA
GOTO HIROSHI
NAKAI JUNICHI
MIKI AYA
GOTO HIROSHI
NAKAI JUNICHI
Application Number:
PCT/JP2012/056371
Publication Date:
October 04, 2012
Filing Date:
March 13, 2012
Export Citation:
Assignee:
KOBE STEEL LTD (JP)
TOMIHISA KATSUFUMI
MIKI AYA
GOTO HIROSHI
NAKAI JUNICHI
TOMIHISA KATSUFUMI
MIKI AYA
GOTO HIROSHI
NAKAI JUNICHI
International Classes:
H01L21/3205; C22C9/00; C22C9/01; C22C9/02; C22C9/05; C22C9/06; C23C14/14; G02F1/1343; G09F9/30; H01B5/02; H01L21/28; H01L23/52; H01L29/786
Domestic Patent References:
| WO2011013683A1 | 2011-02-03 |
Attorney, Agent or Firm:
OGURI Shohei et al. (JP)
Shohei Oguri (JP)
Shohei Oguri (JP)
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Claims:
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